Adhesives for the Assembly of Electronic Devices

E-linking offers custom formulations to meet the rigorous needs of the electronic industry.Formulations are available to meet the evolving needs of the electronic industry. Specific grades are available for:

  • • Printed Circuit Board Adhesives

  • • Semiconductor Adhesives


  • • Conformal Coatings

  • • Die Attach Adhesives

  • • Glob Tops

  • • Lid Sealing

  • • Surface Mount Adhesives

  • • Underfill Encapsulants

E-linking Electronic Grade Epoxies Feature Exceptional Performance Properties

Products are easy to apply and available for use in convenient applicators (including premixed and frozen syringes for two component epoxy systems). Properties of specific grades include:

  • High bond strength to similar and dissimilar substrates

  • Low stress

  • High/low temperature serviceability

  • Fast cures

  • Resistance to water and many chemicals

  • Low coefficient of thermal expansion


International Microelectronics and Packaging Society Member LogoE-linking is a member of the International Microelectronics and Packaging Society.

Microelectronics Packaging & Test Engineering Council LogoE-linking is a member of MEPTEC: Microelectronics Packaging & Test Engineering Council.

Surface Mount Technology Association LogoE-linking is a member of the Surface Mount Technology Association.

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