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Metal Bonding Adhesives

葡京娱乐场E-linking's metal bonding adhesives offer convenient cure schedules, high performance and long-term durability.From aluminum to cast iron to stainless steel to titanium, E-Linking one and two component adhesive systems meet the challenging needs of metal bonding applications. These job proven formulations are presently employed in applications ranging from design and production to repair, maintenance and field service.

Some of the most commonly used metal substrates include:

  • Aluminum

  • Beryllium

  • Cadmium

  • Copper

  • Iron

  • Magnesium

  • Nickel

  • Platinum

  • Titanium

  • Zinc

Some of the most commonly used metal alloys include:

  • Aluminum Alloys

  • Brass

  • Bronze

  • Cast Iron

  • Invar

  • Kovar

  • Nitinol

  • Stainless Steel

  • Steel

Types of Metal Bonding Adhesives

E-Linking's metal bonding systems are presently employed in industries ranging from aerospace, optical and electronic to oil/chemical processing, medical and automotive. Available chemistries include:

  • Epoxies

  • Silicones

  • Polyurethanes

  • Cyanoacrylates

  • UV cures


Most Popular Products for Metals

ELINOPTO E203



ELINOPTO A209

UV curable ashesive and sealant. Low CTE, low stress; Excellent adhesion, structural bonding to a wide variety of substrates; UV Cure, quick speed UV processing.

ELINOPTO  E106-5

Optically Clear, Two Component Epoxy Adhesive. Optical clarity,Bonding of transparent materials; Long pot-life, Ease of use and less waste; General purpose, Bonds well to glass, metal and plastic substrates.

ELINBOND S111One component,low stress

Excellent primerlessadhesion,Structural bonding to a wide variety    of substrates

Excellent weatherability,Quick speed UV processing

ELINBOND S123Test
ELINBOND E107HFHalogen Free, High Strength Epoxy Adhesive.Sag resistance,No flow during cure even on vertical surface; Halogen free,Environment friendly,High hot strength, Structural bonds at elevated temperatures.
ELINBOND  A108Low CTE,low stress

Excellent adhesion,Structural bonding to a wide variety of substrates

UV Cure,Quick speed UV processing


ELINOPTO S303

Strong adhesion,High reliability

High  Refractive index,Enhance LED lumen

No yellowing due to heat and UV light,ong-life LEDs

ELINDUCT A301MLow Temperature Curing,Conductive Die Attach Adhesive. Thixotropic, Low flow during cure; Excellent electric properties, Reliable electronic assemblies; Fast curing at low temperature, High output and low stress.
ELINBOND  E103One component, Ease of use  

Very high trength,Provides structural bonding to a wide variety of      substrates

Non-sag paste,No flow or sag even on vertical surfaces

ELINBOND  401Test
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