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Die/Laser Cut Preforms

E-linking's line of epoxy films and preforms cure at moderately elevated temperatures and feature high bond strength.E-linking's line of epoxy films can be laser or die cut to different configurations for specific application requirements. Preforms are easy to use, require no mixing and reduce waste. They are available in thicknesses of 2 to 8 mils and up to 16 inches square. They offer excellent bond strength to both similar and dissimilar substrates plus high chemical and moisture resistance.

Advantages of Die/Laser Cut Preforms

  • Easy processing and minimal squeeze-out during bonding

  • No need for refrigeration

  • Quick curing at moderately elevated temperatures

  • Custom formulated for applications requiring special performance properties

E-linking preforms are available in electrically conductive, thermally conductive and electrically insulative versions. Formulations can be tailored to meet specific requirements in terms of temperature resistance, chemical resistance, flexibility and more.

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