Lid Sealing of Electronic Packages

High performance epoxy preforms process easily and are available in a range of thicknesses.Electrically insulative epoxy paste and B-staged preform adhesives provide cost effective alternatives to seam welding, soldering or glass attachment in lid sealing applications. They also offer low temperature processing and avoidance of metal particle contamination. These compounds feature high bond strength, thermal stability and superior protection against moisture. Preform systems cure rapidly at moderate elevated temperatures, have controllable flow and long storage stability.












Most Popular Products for Ink Case

ELINBOND E3200COne component, Ease of use

Fast and low temperature cure,Fast production processing

Sag resistant paste,Dispensable on verticalsurfaces

Flexible and resilient,Excellent stress reduction and absorbing properties

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